[Joel_Mckay]

X-ray vision like Superman I gather... nice... ;)

Please dump the problematic cpu/ram chip model numbers to help other users. These chip manufacturer numbers is not really personally identifiable information, as they are shared between hundreds of thousands of products.

The classic cpu-z for Windows users is here if you don't run *nix:

https://www.cpuid.com/softwares/cpu-z.html

Best regards, =3

[Rinzler89]

>X-ray vision like Superman I gather... nice... ;)

That snarkyness is uncalled for. I repasted the laptop, ran benchmarks and checked the temperature sensors plus used my FLIR. It's no thermal issues. It's just AMD iGPU driver buggyness.

  Processors Information
  -------------------------------------------------------------------------
  Socket 1      ID = 0
  Number of cores    8 (max 8)
  Number of threads  16 (max 16)
  Secondary bus #    0
  Number of CCDs    1
  Manufacturer    AuthenticAMD
  Name      AMD Ryzen 7 7840HS
  Codename    Phoenix
  Specification    AMD Ryzen 7 7840HS with Radeon 780M Graphics   
  Package     Socket FP7
  CPUID      F.4.1
  Extended CPUID    19.74
  Core Stepping    PHX-A1
  Technology    4 nm
  TDP Limit    54.0 Watts
  Tjmax      90.0 °C
  Core Speed    2761.5 MHz
  Multiplier x Bus Speed  27.71 x 99.6 MHz
  Base frequency (cores)  99.6 MHz
  Base frequency (mem.)  99.6 MHz
  Instructions sets  MMX (+), SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A, x86-64, AES, AVX, AVX2, AVX512 (DQ, BW, VL, CD, IFMA, VBMI, VBMI2, VNNI, BITALG, VPOPCNTDQ, BF16), FMA3, SHA
  Microcode Revision  0xA704104
  L1 Data cache    8 x 32 KB (8-way, 64-byte line)
  L1 Instruction cache  8 x 32 KB (8-way, 64-byte line)
  L2 cache    8 x 1024 KB (8-way, 64-byte line)
  L3 cache    16 MB (16-way, 64-byte line)
  Preferred cores    2 (#1, #3)
  Max CPUID level    0000000Dh
  Max CPUID ext. level  80000026h
  FID/VID Control    yes
  # of P-States    3
  P-State      FID 0x898 - VID 0xBF (38.00x - 1.194 V)
  P-State      FID 0x858 - VID 0xAB (22.00x - 1.069 V)
  P-State      FID 0xA50 - VID 0x97 (16.00x - 0.944 V)
  PStateReg    0x80000000-0x49AFC898
  PStateReg    0x80000000-0x45AAC858
  PStateReg    0x80000000-0x4425CA50
  PStateReg    0x00000000-0x00000000
  PStateReg    0x00000000-0x00000000
  PStateReg    0x00000000-0x00000000
  PStateReg    0x00000000-0x00000000
  PStateReg    0x00000000-0x00000000

  Package Type    0x4
  Model      00
  String 1    0x0
  String 2    0x0
  Page      0x0
  Power Unit    0.0
  SMU Version    76.73.00
  TDP/TJMAX    0x36005A
  TCTL Offset    0x0
  PMTV      004C0008
  Package Power Tracking (PPT)    54.0 W (current)
  Package Power Limit #1 (long)     35.0 W
  Package Power Limit #2 (short)    25.0 W


  DMI Physical Memory Array  
   location  Motherboard
   usage   System Memory
   correction  None
   max capacity  64 GB
   max# of devices  4

  DMI Memory Device  
   designation  DIMM 0
   format   Row of chips
   type   LPDDR5
   total width  32 bits
   data width  32 bits
   size   8 GB
   speed   6400 MHz
   manufacturer  Micron Technology
   part number  MT62F2G32D4DS-026 WT
   serial number  00000000
   voltage   0.500000
   manufacturer id  0x2C80
   product id  0x0


  Display adapter 0 (primary) 
   ID   0x2180003
   Name   AMD RadeonT 780M
   Board Manufacturer Lenovo
   Codename  Phoenix
   Cores   768
   ROP Units  16
   Technology  4 nm
   Memory size  1024 MB
   Current Link Width x16
   Current Link Speed 16.0 GT/s
   PCI device  bus 99 (0x63), device 0 (0x0), function 0 (0x0)
    Vendor ID 0x1002 (0x17AA)
    Model ID 0x15BF (0x3819)
    Revision ID 0xC7
   Root device  bus 0 (0x0), device 8 (0x8), function 1 (0x1)
   Performance Level Current
    Core clock 800.0 MHz
    Shader clock 400.0 MHz
    Memory clock 800.0 MHz
   Driver version  32.0.11021.1011
   WDDM Model  3.1

[Joel_Mckay]

People use special x-ray machines to inspect the BGA solder bonds to the PCB underneath chips. These chips may also be additionally glued down to the PCB on higher end equipment (impossible to visually inspect.)

Note BGA chips were never initially intended to be larger than 20mm wide, and can still put enormous shear forces on the contact bonds as the solder solidifies post re-flow (and the bimetallic cantilever PCBs form start to pop-back.) A certain percentage of products will thus fail when they warm up as the PCB will locally heat/warp the area again, and foobar a few random connections in the process. A low-heat paint-stripper heat-blower might be able to replicate the crash to eliminate this theory, and you might be able to RMA the board/chips if you are still under warrantee.

Could indeed also just be software as some suspect, but that is a lot harder to find in kernel drivers.

It is hard to read peoples emotions online, but do assume if someone is reaching out to help they probably think you are worth respecting too.

Thanks for posting data other users may find useful, and have a wonderful day. =3

[Rinzler89]

No, it's not a solder/BGA issue because RAM/CPU/GPU stress benchmarks would cause some instabilities but that's never the case. The instability only manifests when running video decode tasks(watching youtube) in the browser and browsing websites in paralel, meaning it's 99% sure a iGPU driver issue.

[Joel_Mckay]

Have you tried h264ify and blocked 60fps video?

Might be interesting if the bug is codec dependent, as YT can stress some browsers configs (software codecs etc.)

Does it do this with the windows 11 driver set as well? =)