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by Joel_Mckay
704 days ago
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People use special x-ray machines to inspect the BGA solder bonds to the PCB underneath chips. These chips may also be additionally glued down to the PCB on higher end equipment (impossible to visually inspect.) Note BGA chips were never initially intended to be larger than 20mm wide, and can still put enormous shear forces on the contact bonds as the solder solidifies post re-flow (and the bimetallic cantilever PCBs form start to pop-back.) A certain percentage of products will thus fail when they warm up as the PCB will locally heat/warp the area again, and foobar a few random connections in the process. A low-heat paint-stripper heat-blower might be able to replicate the crash to eliminate this theory, and you might be able to RMA the board/chips if you are still under warrantee. Could indeed also just be software as some suspect, but that is a lot harder to find in kernel drivers. It is hard to read peoples emotions online, but do assume if someone is reaching out to help they probably think you are worth respecting too. Thanks for posting data other users may find useful, and have a wonderful day. =3 |
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