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by dhimes
4841 days ago
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I had no idea that the manufacturing variation among chips is large enough to create performance tiers. Pass/fail I get, but this sounds like more extreme. Like, the difference between C and fail may be such that some non-negligible percentage of chips that test into the C bin should really be in the fail bin. |
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Remember that the widths of the oxide tracks within the silicon is on average 40nm these days (that's only ~400 atoms across!) or even smaller. with hundreds of process steps. One big molecule from some tiny error in the production process on the wrong part of the chip may not cripple it, but may impede performance, it's just probability at the end of the day.
With regards to potential fails going into production, it does happen, there are several test phases during production to catch as many as you can, but at the end of the day you won't get them all.
Semiconductor fabrication is fantastically expensive, new Fab plants cost several billion to build, so if you want to guarantee quality you have to pay for it.