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by junon 10 days ago
I know all of this; assembly of a $400 board usually has a MOQ of 5 off the top of my head, which for a board that is a prototype isn't feasible.

I know about how to do reflow. I'm asking about the population step after paste deposition.

1 comments

Could also keep your design tolerances less tight (QFN>BGA), and use a cheaper PCB fab house.

In general, for small discreet components they should be able to partially pre-fill the PCB for under $23/pc. The expensive/sensitive stuff you manually add later.

Air-tweezers and a magnifier also do work, but you will get a sore back pretty quickly.

There were a few manual-first exceptions I saw with fussy RF component selection (better s parameters if mounted upside-down), instrumentation grade high-precision components, pricey chips, and avoiding BGA x-ray pad inspection.

Setting up a small home PnP takes time, practice, and space. Not necessary if you just dropped on 5 chips using generic stencils, and re-flow. =3