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by buran77
5 hours ago
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> logic technology can extend for the first time below the 1 nm node, advancing the era of angstrom-level scaling, where dimensions approach the size of individual atoms. While transistor nodes now refer to a generation of manufacturing technology versus an exact physical dimension, IBM’s 0.7 nm technology—also referred to as 7 angstroms—demonstrates how continued scaling remains possible. Continuing the well established trend of making bold claims about physical dimensions that have nothing to do with any of the structures in the chip, and the name scales better than the tech. What they actually deliver is a "nanostack architecture" built with ~5nm features that according to them is comparable to a hypothetical real sub-1nm chip. It's an impressive achievement nonetheless but it looks like the industry has a few too many marketers. |
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For silicon, the gate length of a FET has a lower limit somewhere between 10 nm and 15 nm.
The current CMOS manufacturing processes have not reached the limit yet. For making smaller transistors, a transition to other semiconductor materials will be necessary.
The vertical thicknesses of various layers may be of only a few nanometers or even of a fraction of a nanometer, but that does not matter directly for the circuit density.
The supposed node size refers to horizontal dimensions, not to vertical dimensions.
Vertical dimensions of around 1 nanometer or less could be achieved already many decades ago, because they depend on growth speed and on time, not on lithography, like the horizontal dimensions.
The industry should have stopped decades ago to talk about the "size" but they should have characterized a CMOS process by its density, e.g. in logic gates per square mm.
However, an actual concrete number would be disliked by marketing, because they could no longer claim that their "1 nm" process is better than the "2 nm" process of another vendor, if their density is not really better.