For the case of chip lithography they'd probably make source masks, copy the first generation a time or two, and use those secondary source masks to produce consumable 'stamps' for production.
Hopefully the stamps maintain sufficient quality across at least a couple batches (50-100+?) of wafers.
The stamp doesn't touch the silicon or any other solid material, it hovers just above.
It only touches a liquid photo-resist that is spread on the wafer. The stamp is transparent, which allows UV light to shine though and exposes the photo-resist, which solidifies into a mask matching the stamp.
For the case of chip lithography they'd probably make source masks, copy the first generation a time or two, and use those secondary source masks to produce consumable 'stamps' for production.
Hopefully the stamps maintain sufficient quality across at least a couple batches (50-100+?) of wafers.