|
|
|
|
|
by microarchitect
5315 days ago
|
|
One thing that could work against them is their cost structure. Intel is used to throwing a thousand or so engineers on each design. Having so many designers means they can squeeze out every last MHz, but it also means they need big margins and large volumes to recoup their costs. The other big technical issue is the end of Dennard scaling. For most of the last three decades, scaling CMOS processes bought you three things: more transistors, higher frequency and lower power. Things are different now. We can't really scale frequency any more because we've run into the power wall. We used to get lower power at the same frequency by scaling the supply voltage, but this also required us to scale the threshold voltage (a device parameter). Unfortunately we can't scale the threshold voltage willy-nilly like in the past because leakage power increases for lower threshold voltages and is now a significant contributor to total power. We still get more transistors per unit area, but it's not clear whether the economic costs of building up new fabs and switching to a new process are offset by the benefits of having more transistors to play with. The bottomline is that it's not clear whether Intel's biggest competitive advantage, that of having a manufacturing process superior to everyone else, is still that much of an advantage. PS. One thing I find truly amazing is that Dennard predicted that we'd run into all these problems back in his landmark paper in 1974! |
|
Exactly. It's also not obvious that the mobile chip market will pay a premium for Intel-calibre fabs. If it won't, then the question becomes whether a TSMC-made Atom is better than a TSMC-made ARM.
It's also fairly common to have custom hardware added to SoCs. Is Intel prepared to open up their processes to that sort of thing?
Unfortunately we can't scale the threshold voltage willy-nilly like in the past because leakage power increases for lower threshold voltages and is now a significant contributor to total power.
This one cuts both ways though. With leakage dominating active power, within a given node, the fabrication process will be relatively more important than microarchitecture, which is a point in Intel's favour.