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by ssp
5309 days ago
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One thing that could work against them is their cost structure. Intel is used to throwing a thousand or so engineers on each design. Exactly. It's also not obvious that the mobile chip market will pay a premium for Intel-calibre fabs. If it won't, then the question becomes whether a TSMC-made Atom is better than a TSMC-made ARM. It's also fairly common to have custom hardware added to SoCs. Is Intel prepared to open up their processes to that sort of thing? Unfortunately we can't scale the threshold voltage willy-nilly like in the past because leakage power increases for lower threshold voltages and is now a significant contributor to total power. This one cuts both ways though. With leakage dominating active power, within a given node, the fabrication process will be relatively more important than microarchitecture, which is a point in Intel's favour. |
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This is kinda nitpicking, but I'm not sure leakage will ever dominate active power. We still have the ability to reduce leakage if we want, we just have to give up frequency for it. In the past we didn't have to play this trade-off but even now I don't think it ever makes sense to run your chip so fast that leakage is more than dynamic power.
I do agree that for any given node, Intel is still going to ahead of the rest. It'll be interesting to see how much this helps them.