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by olliej
2482 days ago
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That would be colossally inefficient - essentially the size of the chip means that electrons would be taking multiple cycles to get from one side to the other. The solution would be localizing processing into distinct processing units on the one die. At the point you’ve reinvented multiple cores and it starts becoming cost effective to split them into separate chips to improve yields :) |
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To an extent this has already happened with wafer scale integration, e.g. cerebras.