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by timboslice
3993 days ago
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This is where 450mm wafers and EUV (extreme ultraviolet lithography) were supposed to come in. EUV relieves the need for double patterning and the tremendous additional costs that entails (and was used to manufacture this 7nm chip). The CEO of Applied Materials, Gary Dickerson, has stated that the 450mm wafer timeline “has definitely been pushed out from a timing standpoint.” That’s incredibly important, because the economics of 450mm wafers were tied directly to the economics of another struggling technology — EUV. EUV is the follow-up to 193nm lithography that’s used for etching wafers, but it’s a technology that’s spent over a decade mired in technological problems and major ramp-up concerns. Toasting to the death of Moore's Law:
https://www.youtube.com/watch?v=IBrEx-FINEI |
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A few teething problems would be expected.
7nm has been struggling for a while, 5nm is likely to be late, and I don't think anyone really knows what happens after that.
Longer term, industrial manufacture is probably going to have to move to something exotic like nano-assembly of individual atoms, with some extra finagling to work around tunnelling effects. (Easier said than done...)