Sure, if by "omit" you mean "cover in their FAQ" which says:
The most common and by far the least expensive is soldering a thin wire (or some TTH component's lead) between layers. Depending on the number of vias on your board it can be as entertaining as watching grass grow, but quite often it's the fastest way to get them done.
Another possibility is to press copper rivets (sometimes called eyelets). Rivets can be pressed sufficiently flat, thus allowing to put them under ICs (which is impossible with soldering approach). Though they need more space (i.e. outside diameter of the via needs to be larger) and tend to be less reliable.
There are other possibilities, including the actual electroplating process, but these tend to be fairly sophisticated and expensive.
The FAQ is at http://cirqoid.com/pages/faq, and of course linked in the tabs across the top of the page. Not very well hidden.
The most common and by far the least expensive is soldering a thin wire (or some TTH component's lead) between layers. Depending on the number of vias on your board it can be as entertaining as watching grass grow, but quite often it's the fastest way to get them done.
Another possibility is to press copper rivets (sometimes called eyelets). Rivets can be pressed sufficiently flat, thus allowing to put them under ICs (which is impossible with soldering approach). Though they need more space (i.e. outside diameter of the via needs to be larger) and tend to be less reliable.
There are other possibilities, including the actual electroplating process, but these tend to be fairly sophisticated and expensive.
The FAQ is at http://cirqoid.com/pages/faq, and of course linked in the tabs across the top of the page. Not very well hidden.