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by kragen
4195 days ago
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Getting a modern die photo requires using an electron microscope or a scanning-probe microscope, because feature sizes are down to about a tenth the wavelength of visible light. That alone makes the photos look pretty different. Modern chips also have quite a few more layers (process steps); e.g. IBM's old 0.13μm process supports 8 metal layers, not counting other steps like epitaxial growth and oxides: https://www.mosis.com/vendors/view/ibm/8rf-dm |
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