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by jmpe
4397 days ago
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Same as regular chips: in a grid on a wafer, then cut and pick&placed. Don't forget: yield goes up when the die shrinks because the defects are typically small spots. The smaller the die the better you pixelate the defects. The wafers are only 2 inch diameter to avoid yield loss due to edge effects: at the edge of the wafer you have lowest quality components (optical ring effects) |
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