[Symmetry]

The problem is that NVidia switched the solder connecting their chips to the board without switching the potting material they used to something with the new thermal expansion coefficient. So as the chip changes temperature the thermal stress is turned into mechanical stress, until one of the contacts breaks. The fix in the article will re-form the attachment, but you'll still be accumulating stress and it will eventually fail again.

Google for "bumpgate" for more information about this than you'd ever want.