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by danmatan
4482 days ago
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And from a manufacturing/engineering point-of-view (which I am neither), I guess it's really hard to solve this problem. You have some unpredictable 1/100 or 1/1000 defect that occurs long after production and sale. Just how do you go about isolating the cause, and testing a solution? Make 5 changes, and put through a production batch of 1000 units, and then do accelerated testing? If 5 fail from one batch, and 2 from the rest, is there even enough statistical power to confirm that you've come across a solution? And you just burned through 5000 units. Sounds like fun trying to solve this kind of problem. |
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Currently on mobile, can't link a PDF right now but if you Google " BGA PCB layout guidelines" you'll get a ton of documents.
Lastly: PCBs go through several optimization cycles, some occur after release for high volume stuff. There are always revision numbers of the silkscreen, sometimes they catch an issue like this after x1000 devices in the wild and do an update.