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by ics 4483 days ago
Depends on the alloy, tin/bismuth will melt around 140C. I would've expected over 180C to be necessary as well though. Sn63Pb37 is very common and melts at 180C, but since it has lead I don't think it's used much in large scale electronics manufacture.
2 comments

If your electronics are RoHS compliant (they are), there is no lead.
Apple's laptops are RoHS, so the melting point of that lead-free solder should be even higher than 183 C.
And all the joints look like cold solder joints instead of nice, shiny but toxic, lead-filled goodness.
I use lead-free solder for hobby work. A good joint is still shiny as you'd expect.

I basically notice no difference, except the need for a higher working temperature.

I read somewhere the xbox gpu problem was a result of the lead-free solder used to meet environmental regulations.
THANKS OBAMA
You're blaming RoHS on Obama?
Must have been fond of lead paint as a kid.