| My concerns were similar. What bus can be used which will be fast enough for all of the components to work together? Sticking a cpu, camera, memory, and screen on the same bus will cause an amazing bottleneck. How will the components be made to fit in the same thickness? Can you really fit a higher resolution camera in a larger (but not thicker) package? In that regard, what's to stop someone from making an uber battery which only takes up a few slots but then covers the previous layer on the back, thereby increasing the real estate? How much force can those pins hold? Will the bins be biased in some way such that the positive will be every N pins and negative every M pins, and data lines every L pins or something? If so, will the holes be keyed to ensure proper placement? There are a lot of questions to be answered before this thing can come to fruition, and I think the bus is going to be the biggest limitation. There's a reason this phone doesn't exist yet, as I'm sure hardware manufacturers would love to continue selling people hardware over and over, but there's a genuine problem with bandwidth in this setup where anything can go anywhere. A better solution would be universal plugs/ports with specific uses for each port. Battery port, CPU port, memory port, and then accessory ports, just like a modern desktop. This would allow the components with the largest bottlenecks to have their own dedicated bus. |