|
|
|
|
|
by hajile
35 days ago
|
|
Taalas HC1 AI uses Llama 3.1 8B, but takes up a massive 53B transistors and 815mm2 on TSMC N6 (nearly at the reticle limit of 858mm2). N2 is a little less than 3x as dense (110MTr/mm2 vs 313MTr/mm2). This chip would still be 272mm2 on N2 which is an eye-watering $30k/wafer and bigger than a 9950x or Nvidia 5070. This just isn't feasible. Some of the latest-gen LLMs seem to have 5-10T parameters or about 1000x more. I don't know that taping out just one chip makes economic sense let alone the 300-1000 chips required for a cutting-edge model. Things like continuing education so your model knows about the latest NPM packages or world news is super important, but seems like it would require new chips. There are a TON of uses for an 8B parameter models on the edge, but this is WAY too big to put on the edge of anything. Something like a 10mm2 100m parameter voice model might be feasible on the edge, but only for expensive devices, but most of those are TSMC 28nm (up to 29MTr/mm2) or GF FDX22 (up to 40MTR/mm2) which would increase the AI chip to the point where it would absolutely dominate the BOM. |
|
They probably have a few ideas around that. Me, personally, I'd have one main expensive chip (replaced every 10 years, or whatever), with a secondary cheap chip in front of it that gets replaced every year or so.
The secondary chip could act the way RAG does, or perhaps both chips together can act as LoRA.
Either way, 99.999% of the knowledge is static, you just need to fine-tune the weights with that remaining 0.001% knowledge, which can be done using RAG or LoRA on a much smaller (thus cheaper) disposable chip.