>If measuring from RTL-freeze to tapeout, this is a fairly typical (even somewhat unimpressive) timeline (accounting for some unexpected issues) for a large, complex 3nm chip.
Yeah, "first chip" here likely means they contracted Broadcom (or a firm with similar experience) to do all the heavy lifting. Building out your own in-house teams for this sort of thing is a decade-long project - just look how much inside Apple's early chips was licensed ARM / PowerVR cores
Apple didn't have the talent in-house until they bought Intrincity who worked with Samsung on Apple's earlier Arm chips as well. https://en.wikipedia.org/wiki/Intrinsity