[heidne32]

No; that’s absurd to say it’s physically impossible, it is absolutely possible to etch whatever arbitrary pattern into a physical substrate, physics pending. What is true is that the CPU and DRAM fabrication processes are very unalike, one uses highly complex patterning for the logic, the other uses many blocks repeated for memory, and can be done on a higher process node as it does not require the same intricacy's. It’s not cost efficient to use logic fabrication to make memory. And you won’t get the yield with highly complex patterning for logic from something that is meant to stamp out the same DRAM block billions of times.

So one day, when we have process nodes far smaller what we do today, a DRAM fab can print highly complex patterning for logic, compatible to today’s CPUs on die. And the logic fabs will be making cpus many times more complex than that. Because economics.

[Kirby64]

> No; that’s absurd to say it’s physically impossible, it is absolutely possible to etch whatever arbitrary pattern into a physical substrate, physics pending.

Logic processes do not have the capabilities to even manufacture DRAM. It’s not about cost or yield, they just do not have the correct blocks to make DRAM. The processing to make DRAM makes it incompatible with making logic at the current speeds and densities.

There were some much older processes where you could do both, but those are about 10 years old now and we’ve long since moved on. I do not think there will be a future where you can do both.