[gsquaredxc]

Heat is exactly why this is useful. A very large amount of power draw is due to the physical size of circuits. This monolithic 3D stacking should result in smaller wires for decreased parasitic capacitance. SRAM is probably the biggest winner in some respects. The paper suggests they can make SRAM smaller, and given most of a modern CPU die is SRAM I would be shocked if that wasn’t a huge thermal win alone, either by adding more cache or by reducing the size of the core or both.

I’d be interested to see if you couldn’t throw diamonds at the heat problem though. There was some recent work done suggesting diamond could help a lot with heat, but I’m unsure if it would work here.