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by LarsDu88
21 days ago
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- For high end AI inference chips, DRAM already goes onto the interposer right next to the GPU to bring the bandwidth as high as possible. Apple will eventually do this for the exact same reasons. It's not just soldering RAM to a PCB
- The chiplet technique and putting everything on an interposer is less integrated from the perspective of the chip manufacturer, but for the consumer -- folks who are going to buy Framework laptops, this is a far less integrated package. CPU, GPU and RAM will sit on the same interposer and purchased together as a unit with no upgrade or swap path for any component. This is not the same as simply soldering everything together on one PCB. The level of intergration is far higher |
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The high end AI inference chips use HBM and cost tens of thousands of dollars. HBM uses 1024 data pins instead of 64, which is crazy expensive, which means that to the extent that consumer devices get it at all, it would be in addition to rather than instead of ordinary DRAM, e.g. you might have 12GB of HBM on the CPU package but then 64GB of less expensive DRAM. Increasing the number of cache hierarchy levels is a long-term trend. HBM as L4 cache is pretty plausible for high end CPUs as a supplement rather than replacement for DRAM.
There are already servers that work like this, e.g. Xeon Max has 64GB of HBM but then further supports up to 4TB of DDR5.
Moreover, the AI inference hardware integrates the CPU into the GPU because it's really just a giant GPU. They're not getting some major advantage from that, they just know nobody is going to want to swap out the CPU on a system where the CPU is mostly irrelevant. If you wanted that level of inference performance on a normal PC which is used for other purposes where the CPU actually matters then you would drop the AI accelerator with the HBM or GDDR into a PCIe slot.