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by bsder
31 days ago
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IBM was using flip chip in their mainframes in the same timeframe, too. That doesn't mean usage was widespread. This was 1970-1975, after all. In addition, 2-layer has some big advantages over 4 layer for reliability (won't delaminate under launch vibration, for example)--which is an issue in aerospace. And, to my eye, these boards simply don't look like the have 4 layers nor are the laid out like that:
https://upload.wikimedia.org/wikipedia/commons/7/7a/Mitra_15... Besides, even if it were 4 layers, the issue is still that drilling holes in a non-regular pattern simply wasn't something that could be done easily 1975. |
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