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by Joel_Mckay
61 days ago
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I actually tried mixing in fine copper dust with fine SAC305 paste to create a non-liquid amalgam on re-flow, but the void/inclusion problem was worse than conventional SLS processes. Also looked at RF and metal salt processes, but it had more problems/hazardous-material than traditional laser setups. The core problem is making these machines safe and cheap to use. =3 |
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