older processes would not be feasible due to hard physics constraint: die size. The weights have to physically fit on the chip. At 6nm, an 8B parameter model already takes up 815mm², which is roughly the maximum size for any process. At 28nm, that same model would require a chip roughly 20x larger in area, which is physically impossible on a single die. So older nodes work fine for very small edge-case models (think embedded AI, IoT, voice assistants), but anything resembling a capable LLM needs at least N6/N7-class density just to fit.
Talaas' best case exit scenario is to get bought out by Intel, AMD, Qualcomm or Nvidia, and even automotive chip guys like NXP (automotive/robotics offline use will likely be major area of application for this). if the Taalas HC1 Technology Demonstrator is actually working and producing the results they are publicly claiming, I'm assuming there is a steady stream of visitors from silicon valley and elsewhere at their toronto offices.
Talaas' best case exit scenario is to get bought out by Intel, AMD, Qualcomm or Nvidia, and even automotive chip guys like NXP (automotive/robotics offline use will likely be major area of application for this). if the Taalas HC1 Technology Demonstrator is actually working and producing the results they are publicly claiming, I'm assuming there is a steady stream of visitors from silicon valley and elsewhere at their toronto offices.