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by random_duck
141 days ago
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> The blank areas of the chips are filled with filler cells but most of them are special "ECOFILLER" cells that are basically generic pairs of N/P transistors like a gate array. These can then be turned into any kind of cell just by using metal. They are a little slower but work fine. Oh, this is fascinating. |
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The ECOFILLER gate array style cells are easier to use.
Then during the DRC check process in Calibre we run a check to make sure that the base layers stayed the same and only the metal layers changed. Since we have 18 metal layers in a leading edge node hopefully only metal layers 1 to 3 changed for the metal ECO so you only have to pay to make new versions of that.
A full mask set in 3nm can be over $30 million. Just a new set of metal masks is around $20 million.
A full mask run takes about 4 months in the fab. Normally you tell the fab to keep a few wafers after the base layers and don't manufacture the metal layers. Then when you do a metal respin they get those out of storage and save a month.