[The_President]

You're speaking the truth, as this is not nonsense - it is correct. At the micro level, thermal expansion/contracting is occurring across the variety of the circuit board materials and components. Hot is fine (not too hot), but it is the consistency that makes for longetivity.

I limit power consumption profiles and clock speeds unless higher power is required, and combine that with an oversized cooling system - keeps regular temps consistent.

[Forgeties79]

Yeah that was my understanding as well. Basically it comes down to how much you are warping/straining the materials. It all seems rather intuitive to me but this is not my area of expertise and just because something makes sense doesn’t mean it’s correct lol