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by dharma1
290 days ago
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Give them enough time and they will. EUV will hit limits anyway in a decade. For china it's DUV+packaging for now, NIL/DSA mid-term, and MoS₂/2D chips long term. But wafer scale, defect free 2D logic is 20–30 yrs out, so no EUV shortcut anytime soon |
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