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by bri3d
300 days ago
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One of the biggest problems with water cooling, especially on boards that weren’t designed for it, can be passive components which don’t usually have a heatsink and therefore don’t offer a good surface for a water block, but end up in a thermal design which requires airflow - resistors and FETs are common culprits here. Commodity assemblies are also a big problem, with SFPs being a huge pain point in designs I’ve seen. The problem is often exacerbated on PCBs designed for air cooling where the clearance between water cooled and air cooled components is not high enough to fit a water block. Usually the solution when design allows is to segment these components into a separate air cooled portion of the design, which is what Google look to have done on these TPU sleds (the last ~third of the assembly looks like it’s actively air cooled by the usual array of rackmount fans). |
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You would have a liquid block on the CPU but you'd also have a heat sink on top that transfers heat from the air to the coolant block, working in reverse compared to normal air cooling heatsinks. The temperature difference would cause passive air circulation and the liquid cooling would now cool both the CPU and the air in the box, without fans.
Seems like something someone would have thought about and tested already though.