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by ryao
384 days ago
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The processes used for logic chips, and the processes used for NVM are typically different. The only case I know of the industry combining them onto a single chip would be Texas Instruments’ MSP430 microcontrollers with FeRAM, but the quantities of FeRAM are incredibly small there and the process technology is ancient. It seems unlikely to me that the rest of the industry will combine the processes such that you can have both on a single wafer, but you would have better luck asking a chip designer. That said, NVM often has a wear-out problem. This is a major disincentive for using it in place of SRAM, which is frequently written. Different types of NVM have different endurance limits, but if they did build such a chip, it is only a matter of time before it stops working. |
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Every microcontroller with on-chip NVM would count. Down to 45 nm, this is mostly Flash, with the exception of the MSP430's FeRAM. Below that... we have TI pushing Flash, ST pushing PCM, NXP pushing MRAM, and Infineon pushing (TSMC's) RRAM. All on processes in the 22 nm (planar) range, either today or in the near future.
> This is a major disincentive for using it in place of SRAM, which is frequently written.
But isn't parameter memory written once per model update, for silicon used for inferencing on a specific model? Even with daily writes the typical 10k - 1M allowable writes for most of the technologies above would last decades.