[throwaway_3133]

It's a multi-project wafer not a multi-project chip.

They cut the wafer apart into individual chips. There is one project on each chip.

This has been going on since the 1970s. It is a very well-understood process.

[throwaway_3133]

All eFabless designs for the first two years of the program were multi-project wafers with single-project chips. And they still required the management engine.

Over the past year they tried an experimental "multi-project chip" (first samples shipped 14 months ago). But the management engine was a requirement long before this happened.

GP seems to have edited their comment, but I can't edit mine (even though it is only 8 minutes old)

[immibis]

Tiny Tapeout is a multi-project chip not a multi-project wafer.