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You use SerDes high speed serial links (up to 224 Gbps in 2025) to communicate between chips. A PCIe lane is just a Serdes with a 30% packet protocol overhead that uses DMA to copy bytes between to SRAM or DRAM buffers. You aggregate PCIe lanes (x16, x8, x4/Thunderbolt, x1).
You could also built mesh networks from SerDes but now instead of PCIe switches You would need SerDes switches or routers (Ethernet, NVlink, Infiniband). You need those high speed links between chips for much more than SSD/NVME cards. Other NAS, Processors, Ethernet/internet, Camera, Wifi, Optics, DRAM, SRAM, power etc. For intercore communication (between processors or between chiplets), between networked PCB's, between DRAM chips (DDR5 is just another SerDes protocol), Flash Chips, camera chips, etc.
Any other chip at faster then 250 Mbps speeds. I aggregate all the M4 Mac mini ports into a M4 cluster by mesh networking all its Serdes/PCIe with FPGAs into a very cheap low power supercomputer with exaflop performance. Cheaper than NVDIA. I'm sure Apple does the same in their data centers. My talk [1] on Wafer Scale Integration and free space optics goes deeper into how and why SerDes and PCIe will be replaced by fiber optics and free space optics for power reasons. I'm sure several parallel 2 Ghz optic lambdas per fiber (but no SerDes!) will be the next step in Apple Silicon as well: the M4 power budget already is mostly in the off-chip SerDes/Thunderbolt networking links. [1] https://vimeo.com/731037615 |
That sounds super interesting, do you happen to have some further information on that? Is it just a bunch of FPGAs issuing DMA TLPs?