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by tonetegeatinst
621 days ago
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I'd bet that making a chip the size of the waver has the benefit on not losing any silicon to dicing the wafer up like a desktop or GPU chips coming from a wafer. Major downside is you need to either have a massive x and Y exposure size or break the wafer into smaller exposures which means your still needing to focus on alignment between the steps, and if a defect can't be corrected then is that wafer just scrap? |
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