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by petra
720 days ago
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My guess is that testing complexity is a function of the number of gates, so it doesnt matter too much if they are on a big die or many small dies. Also testing is an extremly paralell process, scaling with the number of connections you can connect to the tested wafer, and recent technology(from testing hbm ram) can really scale that: https://www.formfactor.com/applications/high-volume-test-on-... |
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