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by exe34
770 days ago
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The issue with large components (we're talking microns instead of 20nm), is the launch weights (coming down), and power (also coming down). Large components also mean larger silicon dies which are much more expensive, and/or fewer components per die, which means now the CPUs are on different chips and need interconnect, which increases latency and interference. Not impossible, just a load of min-max-ing to do. |
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