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by oneplane
770 days ago
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On the other hand, with a reflow station everything becomes modular and repairable. I do hope that a more widespread usage of compressed attachment gives us some development in that area where projects that were promising modular devices failed (remember those 'modular' phone concepts? available physical interconnects were one of the failures...). Sockets for BGAs have existed for a while, but were not really end-user friendly (not that LGA or PGA are that amazing), so maybe my hope is misplaced and many-contact connections will always be worse than direct attachment (be it PCB or SiP/SoC/CPU shared substrate). |
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As much as I like socketed / user-replaceable parts, fact is that soldering down a BGA is a very reliable way to make those many connections.
On devices like smartphones & tablets RAM would hardly ever be upgraded even if possible. On laptops most users don't bother. On Raspberry Pi style SBCs it's not doable.
Desktops, workstations & servers are the exception here.
Basically the high-speed parts of a system need to be as close together as physically possible. Especially if low power consumption is important.
Want easy upgrades? Then compute module + carrier board setups might be the way to go. Keep your I/O connectors / display / SSD etc, swap out the CPU/GPU/RAM part.