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by kurthr
808 days ago
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Obviously not the designer, but my guess is to lower capacitive loading on the matched high frequency signals (those with squiggles on top and flood underneath) and make modeling and IC mounting easier without flood. Note there's not flood near those either. I'm not quite sure on the ordering in the picture but it looks like 123/654? (edit ahh looks like the text was wrong and it is 123/456 with 2&4 Gnd). I'll note it looks like the internal "low speed" digital signals are squeezed between the gnd/pwr (edit: between gnd/gnd) planes, which is probably good since they're usually the biggest source of "noise" if you keep it away from other PCBs. You'd definitely want power/gnd planes immediately next to each other since bypass caps don't work at anything close to this frequency. |
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