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by formerly_proven
815 days ago
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Their process strategies lined up at final gen DUV and 1st gen EUV, but are divergent for the future: TSMC isn’t using high NA EUV for the time being and instead focuses on multi-patterning. Intel is instead trying to push high NA EUV into production first. We will see which works out; they can of course also both achieve success in different ways. |
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