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by samcheng 812 days ago
Ah - I see, the DRAM is literally BGA'd right next to the die. So that $200 upcharge is mostly profit... Thank you!
1 comments

It's called "package on package". The RAM is different chip, however it's located very close to the CPU chip and both are under a single cover. The end result is a "package".

I think that GPUs use similar approach.

AMD Vega used HBM next to the GPU die, but most GPU manufacturers are now back to discrete chips on the GPU circuit board.