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by gaudat
824 days ago
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It all comes down to cost. These BGA chips have pins under the device unlike older packages like QFP or DIP. The pattern of missing pins is designed so it a fewer signal layers to bring out all the sigal connections in a typical PCB process. Devices with full grids would need more layers or tighter tolerances. The appeal of STM32MP1 is you can put DDR momery with the chip on a 4 layer board. ST even provides the layout. |
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