[Nokinside]

>There is a huge AI chip shortage right now, so basically, every big AI player has some kind of chip program going.

Mostly bike-shedding. Designing new architectures for older generation technology nodes adds some capacity, but does not help with the bleeding edge.

The shortage is in fab level. There are multiple bottlenecks. ASML has $36 billion backlog. There is not enough advanced packaging available. Hybrid bonding machines are in short supply. This technology requires lithography-level clean rooms (ISO 1 or ISO 2),and surface smoothness. Die-to-wafer hybrid bonding for large logic is currently very expensive.