[nerpderp82]

How are the masks(molds) created for the Canon process?

https://global.canon/en/technology/nil-2023.html

Would they still have to make a standard photomask and use that to produce a mold using EUV lithography? At which point a cheaper process could be used for production. ASML would still be in that supply chain, but only for mold production.

> In addition to the technology enabling high-accuracy measurement of positional-deviation information, matching technology enabling alignment with lower-layer patterns is also important. Canon has developed a proprietary matching system that achieves alignment by using laser irradiation to thermally deform the wafer (Fig. 2). This system makes it possible to change the heat input pattern and freely deform the wafer by controlling an ultra-fine mirror group called a Digital Micromirror Device (DMD). Instead of assuming that thermal deformation of the wafer worsens alignment precision as is conventionally thought, Canon has applied an innovative new approach to the alignment (Fig. 3).

This is damn cool (hah)! They use a DMD to deposit packets of heat to different parts of the mold to warp to match the underlying layer it needs to imprint for localized nm level positioning. Bad ass.

Am I wrong?