[systems_glitch]

Packaging had been a limiting factor for a long time, e.g. the Intel 8008 has the weird multiplexed bus it has, and requires so much external logic, because Intel was largely "just" a memory chip company at the time and couldn't package bigger than 18 pin DIPs.

Prototype carriers were likely significantly more expensive for >40 pin DIPs, just due to the lower demand. The ceramic packages with a die well and glued or brazed lid are available as an off-the-shelf item for low run, prototype, or special chips, and that's what a lot of chips back then started off in, including the Z8000.

As other comments suggest, escape routing was also a secondary issue. Not a problem for "Texas cockroach" 64-pin DIPs, but PGAs and such.

[tony69]

> because Intel was largely "just" a memory chip company at the time

Intel management didn’t want to pivot to microchips despite the team’s pleads, so they left and founded Zilog, which eventually prompted Intel to pivot (https://www.amazon.com/Silicon-Invention-Microprocessor-Scie...)