Would be fun of them to get a keynote speech from someone involved with EPS[1] (no, not that EPS[2]). I do wonder what parallels the two kinds of packaging have in common.
As an expert in the software kind of packaging but only casually knowledgable about the electronics kind, I suspect rather little. However, the former is probably going to be much more prominent in the microelectronics world soonish, as dynamically configurable chips based on FPGAs are becoming very popular, and highlight more than ever how inadequate the conventional IDEs and SDKs for embedded software are. Proper software packaging is almost non-existent in embedded software engineering, but the current work-around of just using one company's SDK for everything won't scale to support all the FPGA cores that people want to use.