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by IMSAI8080
1132 days ago
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The answer to this might be more application specific accelerators and 3D stacking. You can't afford to have all of a chip switched on at once because of the power consumption and dissipation, so you build more optimised accelerators and keep flipping between them as you encounter different pieces of code that may benefit from each accelerator. Only a fraction of the device is ever in use at once. You 3D stack the chips to get more transistors in the same space. NAND flash chips are already 3D stacked, often with 100 layers or more. |
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