[ejiblabahaba]

You're already seeing it. Xilinx led the industry in chip interconnect technology, SERDES, MCMs, die stacking... they've been making chiplet designs since 2011. They were the ones inventing all the interconnect and packaging technology AMD is using in Zen, Epyc, and now Radeon products.

This sketchy-looking link is a marketing slide for Xilinx chip-to-chip interconnect tech from 2019. It's illustrative of the kind of IP AMD was shopping for. https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4...