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by psacawa
1251 days ago
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Very interesting. Anyone has any idea about the technology that could be used for imaging more dense ICs and multilayer PCBs? In a presentation elsewhere, Ken says that he used a metallurgical telescope and USB microscope. So the imaging is done with visible light and limited resolution. It is enough for old chips, e.g. the 8086 discussed in this article is made with a 3um process. As I look around I see recent Intel chips haven't been reversed. [0] There are allusions to x-ray tomography and electron microscopes [1]. Anyway a plebs can get close for cheap? [0] https://reverseengineering.stackexchange.com/questions/5878/... [1] https://www.youtube.com/watch?v=WOZqoTuAGKY |
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