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They struggle because Apple paid upfront for capacity that didn't exist. That allowed TSMC to buildup capacity and secure lithography machines from ASML.

Intel struggled because of piss-poor decisions by execs:

- Reduce stake in ASML

- Not use EUV for 10nm

- 14nm++++++++++

- That was fine (for some time) because Intel had no competition from AMD

- Thinking that 4 cores 8 thread is what consumer needs (if it weren't for AMD we'd still top of the line i7, or how they call it today i9, would still have 4 cores and 8 threads)

- Not seeing that new node is getting more and more expensive in terms of R&D and that pure-play fabs have gigantic advantage

When AMD Zen happened, Intel got caught with its pants down.

Samsung "struggling" because they couldn't outbid TSMC for EUV machinery (wonder where TSMC got money from...)

Capacity for cutting-edge nodes is limited purely on how fast EUV machinery can be delivered. Currently, it's limited by ASML production capacity.