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by modeless
1477 days ago
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Seems silly to me. CPU designs are important, but these companies have more than enough engineers to make competent designs even with some people leaving. There's another factor that completely dominates. It's all about the fabs. Intel lost the performance lead, was it because of their designs? No, it's because they lost the lead in fabs. AMD passed Intel, was it because of their designs? No, it's because they use TSMC's fabs and TSMC passed Intel. Apple blew everyone away with M1, was it because of their designs? No, it's because they paid TSMC boatloads of money for exclusivity on their latest fabs. Apple M2 disappoints on CPU performance, is it because of their designs? No, it's because TSMC's next fab isn't ready yet so they're still using the same fabs as M1. These days I care more about which TSMC process node my chips came from than which company designed them. I need a new computer but I'm waiting until next year because there will be a wave of new CPUs and GPUs coming out with much better performance. Better designs? Maybe a little, but it's really because they're all moving to TSMC N4. I really hope Pat Gelsinger can save Intel's fab business because we really need another company that can compete in fabs and Samsung isn't doing too hot either. |
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The fixation on the fab process is bewildering. Yes, it does help, but it is also an optimisation step that is decoupled from and that bears no relevance on the chip design. Yes, the smaller node size also brings the increased density along and an increased number of things that can be whacked into the same sized piece of silicon, but it will not magically improve the overall system performance or result in the linear architecture scalability.
The article is specifically calling out a potentially decreased ROB size in M2 cores, and ARMv9 also potentially not arriving until M3 which are crucial to the speed or software performance. There is absolutely nothing the fab process can do to make SVE2 and matrix instructions automagically appear in lithographic chip designs – those are the «silicon» design time decisions. As we have recently been seeing more and more practical, mainstream use cases of the advanced use of the SIMD instructions at the C/C++/Rust runtime level that bring an order of magnitude level performance gains, having the SVE2 implementation at the ISA level is becoming somewhat critical.