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by blihp
1492 days ago
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How they do it at a conceptual level isn't a big secret: they don't need to minimize die area the way other companies do. For Apple, the die is just part of a chip that is part of the larger system they sell that they can amortize the cost over. nVidia doesn't have a system to do that with so their natural inclination is to lean towards keeping the die size as small as possible and just overclock the hell out of it. (right there is the 'trick': Apple can afford to do things that chew up die space that nVidia and others can't while maintaining their profit margins) Being a process generation ahead is also a rather huge thing too. (which is another thing they can amortize the cost of over large numbers of complete systems and mobile devices which their competitors can't) Also related: Apple designs their hardware to do just what they want it to while everyone else is designing for a more general use case. This also costs die area, IP licensing fees etc. |
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Of course, my perspective here might be extremely naive, I know very little about semiconductor technology, just trying to understand the principal design differences.